NASA Office of Logic Design

NASA Office of Logic Design

A scientific study of the problems of digital engineering for space flight systems,
with a view to their practical solution.


RT54SX72SU  Heavy Ion Test

UMC Die, 0.25 µm

BNL, April, 2004

This page is the report for the single event upset part of the test..  The  portions of this test concerning destructive effects  (e.g., latchup and rupture) may be found on page bnl_04_2004_sx72su.htm

Summary

Device: RT54SX72SU

Package: CQFP256

Serial Nos.

LAN7001, D/C 0410
LAN7002, D/C 0411
LAN7003, D/C 0411

L/C: DOY311

Test frequency: Varied, see chart below.

Ions used: Bromine and Iodine

Antifuse rupture: Detected.

SEL: Not detected.

Loss of control, i.e., JTAG upset: not detected.

(Note for SEU testing; that data will be supplied in a separate report).  Since the K-Latch uses redundant structures, the angle of rotation can be critical to making an accurate measurement. This includes not only the magnitude of the angle and the range of the ion, but also the direction of the rotation. The redundant K-Latch circuits are implemented with the redundancy in the "long" direction of the die, as showed in the figure below.

Testing was performed rotating the DUT in two directions.  The main angle, which is normally used at BNL, is rotation, and is around a vertical axis as shown below.  The second axis used was roll.  Roll is about an axis that is perpendicular to the part - that is, in the direction of the beam.

   ++++++++++++++++++++++++++++++++++++++
   +                                    +
   +               DIE                  +
   +                                    +
   +                                    +
   ++++++++++++++++++++++++++++++++++++++
   ^                 ^
   |                 |
   PIN 1             |
                     |
                     |
                     |
                     |

               axis of rotation

The beam is going directly into the screen.

SEEDutCard.gif (1614112 bytes)  
RTSX72SU DUT and card.

Test Logic Design

The logic design, called TMRSXS, has four 100-bit (flip-flops) shift registers: SOFTA, SOFT, HARDA and HARD, which are clocked by a common clock.  Each bit in SOFTA is a D flip-flop constructed by a register cell.  A buffer separates each bit.  Because this buffer has only one fan-out, it permits the fastest type of connection, called a Direct-Connect.  DOC is the output of SOFTA.  SOFT is identical to SOFTA except that there are no buffers between the bits, so there are no Direct-Connects.  DOS is the output of SOFT.

 

Each bit in HARDA is triple module redundant (TMR) hardened at the user-level.  Note that the user-level TMR is different from the hard-wired TMR, which is transparently designed in each register cell.  Each user-level TMR bit consists of three flip-flops and two muxes and an inverter.  The first mux functions as a majority voter.  The second mux and the inverter function as a disagreement detector.  The outputs of all disagreement detectors in the register are logically input to an OR gate.  To detect SET, an extra buffer and inverter are added to the "clear" and "preset" pins of each user-level TMR bit.  Any ion strike on either the inverter or the buffer will potentially upset the three flip-flops simultaneously.  DOVH is the output of HARDA, and the output of the OR gate connected to all the disagreement detectors is 0_ERR.  HARD is similar to HARDA except that there is no additional SET detecting buffer or inverter in each user-level TMR bit.  DOH is the output of HARD, and the output of the OR gate connected to disagreement detectors is 1_ERR.

Test Design

10% de-rating of the nominal power supply, i.e. VCCI/VCCA = 4.5/2.25 V, is used for the worst-case scenario SEU measurement.  This is the minimum of the manufacturer's recommended operating range.


Physical orientation of the K-Latch based R-Cell.
The ion beam is going directly into the screen.

Test Data

Note:  Only low voltage SEU data is reported here for a worst-case test scenario.  Runs at high voltage and after the detection of rupture are documented in a companion report.

Bias Conditions: VCCI = 4.5VDC.  VCCA = 2.25VDC.

BNL
Run

DUT

Ion

LET

MeV-cm2/mg

Tilt

Deg

Roll

Deg

Fluence

Ions/cm2

Upsets

Data

Pattern

Clock

Freq

Comments

 

1_Err

DOC

DOVH

DOS

DOH

0_Err

851

LAN7001

Br-81

37.5

0

0

1.00E+07

0

0

0

0

0

0

Zero

10M

 

852

LAN7001

Br-81

37.5

0

0

1.00E+07

0

1

0

1

0

0

CB

10M

 

853

LAN7001

Br-81

37.5

0

0

1.00E+07

0

1

0

2

0

0

CB

10M

 

854

LAN7001

Br-81

43.3

30

0

1.00E+07

0

1

0

2

0

0

CB

10M

 

855

LAN7001

Br-81

53

45

0

1.00E+07

2

1

0

4

0

1

CB

10M

 

856

LAN7001

Br-81

53

45

-90

1.00E+07

0

1

0

2

0

0

CB

10M

 

857

LAN7001

Br-81

43.3

30

-90

1.00E+07

0

0

0

3

0

0

CB

10M

 

858

LAN7001

Br-81

43.3

30

-90

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

859

LAN7001

Br-81

53

45

-90

1.00E+07

0

1

0

0

0

0

CB

0.5M

 

860

LAN7001

Br-81

53

45

0

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

861

LAN7001

Br-81

43.3

30

0

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

862

LAN7001

Br-81

37.5

0

0

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

863

LAN7002

Br-81

53

45

0

1.00E+07

0

2

0

4

0

1

CB

10M

 

864

LAN7002

Br-81

53

45

0

1.00E+07

0

0

0

2

0

0

CB

0.5M

 

865

LAN7002

Br-81

37.5

0

0

1.00E+07

0

1

0

0

0

0

CB

10M

 

866

LAN7002

Br-81

37.5

0

0

1.00E+07

0

0

0

1

0

0

CB

0.5M

 

867

LAN7002

Br-81

53

45

-90

1.00E+07

0

3

0

2

0

0

CB

10M

 

868

LAN7002

Br-81

53

45

-90

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

869

LAN7003

Br-81

53

45

-90

1.00E+07

0

3

0

4

0

1

CB

10M

 

870

LAN7003

Br-81

53

45

-90

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

871

LAN7003

Br-81

53

45

0

1.00E+07

0

0

0

2

0

3

CB

10M

 

872

LAN7003

Br-81

53

45

0

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

873

LAN7003

Br-81

37.5

0

0

1.00E+07

0

0

0

1

0

0

CB

10M

 

874

LAN7003

Br-81

37.5

0

0

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

875

LAN7003

I-127

59.7

0

0

1.00E+07

0

2

0

2

0

2

CB

10M

 

876

LAN7003

I-127

59.7

0

0

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

877

LAN7003

I-127

104

55

0

1.00E+07

0

1

0

0

0

2

CB

10M

 

878

LAN7003

I-127

104

55

0

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

881

LAN7002

I-127

59.7

0

0

1.00E+07

0

1

0

5

0

2

CB

10M

 

882

LAN7002

I-127

59.7

0

0

1.00E+07

0

0

0

0

0

0

CB

0.5M

 

887

LAN7001

I-127

59.7

0

0

1.00E+07

2

1

0

2

0

1

CB

10M

 

Notes and Analysis

  1. The figure above shows the importance of the board orientation; it also shows the relative orientation of the board and the hard-wired TMR flip-flop or R-Cell, which logically has three sub-flip-flops, ff1, ff2 and ff3. Physically, each  master and slave latch is composed of three redundant and interlocked K-Latches.  Only when two or more of the sub-flip-flops suffer upsets simultaneously due to an ion strike, can the TMR flip-flop can have an upset. Thus the device  under test can not be rotated in an arbitrary single degree of freedom to increase the effective LET for SEU measurement.  Note also that by sweeping both roll and tilt, an ion can traverse several redundant elements.  Of course, this also reflects the natural space radiation environment.  The magnitude of roll and tilt is limited by shadowing of the socket.  Next generation boards will surface mount the DUTs.
  2. The data in the table shows that the SEU-errors are relatively independent of the roll angles. This insensitivity to the board orientation can be explained by the physically wide separation of the redundant latches.  Three dimensional mixed mode simulation demonstrated that even at 0°-roll and 60°-tilt orientation, a single heavy ion with LET of 100 MeV•cm2/mg cannot upset the TMR flip-flop.
  3. The DOC string (BUFD between R-Cells) had a total of 20 errors reported while DOS (R-Cell to R-Cell) had a total of 35.
  4. DOVH and DOH show no SEU errors even for 10 MHz clock while DOS and DOC show noise level SEU errors for 0.5 MHz clock and observable SEU errors for 10 MHz. This indicates the SET detecting buffers and inverters in DOVH are not susceptible to ion strikes even with the high LET used in this test, and also that the SEU-errors in DOS and DOC are due to the SET inside the hard-wired TMR flip-flop.
  5. There are very few SEU errors in 1_ERR and 0_ERR, even for 10 MHz clock.
  6. The figure below shows the cross-section per flip-flop with respect to LET. In this Figure, the data are derived from the DOS and DOC data in table that use the checkerboard pattern and the worst-case bias scenario, i.e. VCCI/VCCA = 4.5/2.25 V. As shown by the legend, the points are experimental data grouped by DUT clock frequency; each data point represents the average of the three DUTs. Clearly, the cross-section, or SEU-error, is strongly dependent on the clock frequency. SEU-errors for 10 MHz clock is about an order of magnitude higher than SEU-errors for 0.5 MHz. In fact, 0.5MHz data are practically in the noise level since a single error in each run can be just a noise due to accelerator operation. SpaceRad 4.5 simulator performs the SEU prediction by applying Weibull parameters to GEO solar-minimum environment with 100-mil Al shielding; the SEU rate is 3.93x10-12 upsets per bit-day for 10 MHz, and 2.2x10-14 upsets per bit-day for 0.5 MHz.

 

 

 

Reference

"An SEU-Hard flip-Flop for Antifuse FPGAs," Katz, R, J.J. Wang, J. Mccollum, B. Cronquist, R. Chan, D. Yu, I. Kleyner, and W. Parker, 2001 MAPLD International Conference, September 2001, Laurel, Maryland.


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