Destructive Physical Analysis Report on the RT54SX16, D/C 9937. Specification GSFC S-311-M-70
Test Report Comments
One sample (S/N 024) was subjected to bond-pull test. There were 63 bond failures of less than 3.0 gf on this device. ... All bonds that failed were at the interface of the ball bond to the die bonding pad indicating potential surface contamination at the bond surface.
Last Revised: February 03, 2010
Digital Engineering Institute
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