Two RTAX1000S FPGAs were sent to Hi-Rel Laboratories for a destructive physical analysis (DPA). The testing was performed in accordance with GSFC S-311-M-70, MIL-STD-1580B REQ. 16.1, MIL-STD-883 Method 5009, and applicable military standards.
Issues were found with the wire bonds on the first device, S/N 61287, and the analysis was stopped. Additional devices have been sent to DPA Laboratories for analysis.
Part Number: RTAX1000S
Lot Date Code: 0444
Wafer Date Code: D1GAH1
Report and Images
The pictures below are of higher quality then the corresponding images in the .pdf file above.
die shots, nice color
die shots, with and without pin numbers
The following files originally came in a .tif format and were converted to .jpg (will post when they come in).
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Last Revised: February 03, 2010
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