NASA Office of Logic Design

NASA Office of Logic Design

A scientific study of the problems of digital engineering for space flight systems,
with a view to their practical solution.

Handling of Parts - Subsequent Testing or Analysis

When removing any part from a board that may be subjected to additional testing or analysis, it is very worthwhile to have the technician spend a bit of extra time removing the part with care, particularly with high pin-count leaded packages.  As we can see from the photographs below, preparing this part for additional testing will be a challenge.

chip_pic_side.jpg (2058 bytes)chip_pic_top.jpg (5497 bytes)chip_pic_bottom.jpg (2888 bytes)

Yes, it was a challenge, but Actel makes the save!!!

top_view_after_rework.jpg (48189 bytes)bottom_view_after_rework.jpg (48051 bytes)

 

Additional Notes

"Actel Device Removal Instructions for Failure Analysis Tech Brief," Actel Corp., March 2004.

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Last Revised: February 03, 2010
Digital Engineering Institute
Web Grunt: Richard Katz
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