"Mechanical Aspects of Column Grid Array (CCGA) Package"

Raymond Kuang
Actel Corporation

Abstract

Traditional CQFP(ceramic quad flat pack) or CPGA(ceramic pin grid array) are no longer suitable for today's high I/O count FPGA devices.  Higher pin count packages such as CCGA(ceramic column grid array) become necessary for packaging today's high density FPGA devices for space application. Qualification of CCGA included board level(temperature and vibration data) and assembly level reliability data on Actelís RTAXS devices will be presented.

 

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