"Digital Device Obsolescence A Very New and Innovative Interconnection Solution"

C. Val, M.C Vassal, and T. Dargnies
3D PLUS

Abstract

The 3-D stacking technology started more than 10 years ago recently allows to solve obsolescence problems in a very smart way. Hence, for obsolete ASIC the alternative consists in either rebuilding an ASIC or rebuilding a PCB through the use of FPGA.  In both cases, the solution is very long to put into place and very expensive. The solution proposed by 3D PLUS consists is not rebuilding the ASIC and since very shortly, in rebuilding the PCB by manufacturing a package which will have exactly the same pin-out and the same size as the obsolete component.

Naturally, this approach applies to ASIC but also to memories, processors, and to all types of obsolete components.

The work consists in the building of an extremely simple 3-D module, generally with only 2 levels, one of the levels being used to place the power converter, then go from 1 to 2, or 3V for instance, as well as a few components such as EEprom for the FPGA, or a few passive components if necessary.

It is obvious that very often the FPGA for instance is much larger and has more inputs and outputs than the obsolete component. Thanks to our 3-D technology, we can cut within the FPGA package and modify its interconnection.

An extension of this technique allows to build ultra low profiles SiP while using standard plastic packages (TSOP, BGA, etc), each package being thinned and cut as a whole in order to make a 3-D module, the thickness of each of its levels being around 0.3 to 0.5 mm; whereas if we stacked the packages as they are, we would have the thickness of the package i.e. between 1 and 1.7 mm, plus the thickness of a PCB to interconnect them.

Numerous examples of obsolescence and SiP will be presented.future

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