Jim Lyke (AFRL) is a nationally recognized pioneer in the development of novel approaches of packaging spacecraft electronics. He received the 2000 and 1997 Air Force Science & Engineering Awards in Exploratory or Advanced Technology Development, and in 1992, the Federal Laboratory Consortium Award for Excellence in Technology Transfer. His research interests include advanced packaging and reconfigurable system architectures, particularly as they apply to space system. His advancements in microelectronics packaging, multi-chip modules, and wafer scale integration enable the construction of space systems that are dramatically smaller, lighter, and less power hungry than the current state-of-the-art. The result is that large satellites can be redesigned for greater capability and smaller launch vehicles greatly reducing their cost.

Dr Lyke has lead over one hundred in-house and contract research efforts involving over 50 different multichip module (MCM) designs. He has authored or co-authored over 80 publications, four receiving best paper awards. He has also been awarded six US patents for architecture concepts, and several other patents are in various stages of preparation. His primary pursuits are the development of space microsystems technology through a research group he leads at the Air Force Research Laboratory. He has worked aggressively to ensure an understanding of these new technologies within the space community, especially as they pertain to improving capability, reliability, and affordability to spaceborne systems.

Dr Lyke has a BSEE (University of TN, Knoxville), an MSEE (Air Force Institute of Technology), and a PhD EE (University of New Mexico).

Seminars: 2005 MAPLD International Conference